The world's fastest, 200WPH throughput capable coat/develop track system performance is enabled by wafer transfer system optimization and the ability to mount additional process modules. The RF3T represents the top-of-the-line productivity and performance enhanced model in the RF3 platform series with additional Cost-of-Ownership (CoO) savings by maintaining higher throughputs without sacrificing process margins and a new chemical consumption volume reduction system. Improved wafer transfer efficiency, increased process module integration such as eight (8) develop, and faster bake set-temperature changability extends the RF3 platform with higher producitivity. New resist consumption reduction system further enables Cost-of-Ownership improvements. RF3T offers unique immersion process defect control solutions.