The RF3S is a higher throughput, upgraded version of the highly regarded, highly reliable RF3 platform with additional features not available on the original RF3. The RF3S has a flexible system design to support immersion ArF lithography processes, including top-coat coating and removal. The RF3S immersion option package incorporates SOKUDO’s unique wafer clean and dry technology which is particularly useful in preventing defects in immersion process. Over 200 systems installed, 200mm-300mm Stable, isothermal Rapid Hot Plate (RHP) NeXusTM Real-Time SPC system monitoring 180WPH throughput, 20% faster than RF3 60% shorter develop process by ECO nozzle Optimized scanner interface communications 45nm and beyond lithography ready <0.8nm, 3-sigma CD Uniformity within wafer Biased Hot Plate (BHP) for best CDU Immersion ArF <0.1 defects/cm2 by SDC Soak ArF, KrF, i-line, BARC, SOG, Color filter, etc. Integrated OCD metrology option