Dainippon Screen, a leading supplier of processing equipment to the world-wide semiconductor market, is proud to release of its next generation coat-develop track for advanced Deep-UV lithography: the RF3(pronounced "R-F-cubed"). The RF3 product name represents the design criteria employed in its manufacturing. High reliability is the foundation of the new system, delivering the MTBF and uptime consistency mandatory for IC production and integration with state-of-the-art scanners. Dainippon Screen is well known for its manufacturing of highly reliable equipment. High reliability is the foundation of the RF3 and paramount in the era of multi-billion dollar fabs and advanced Deep-UV lithography. Throughput is particularly important when you are linked to the most expensive piece of equipment in the fab: the scanner / exposure tool. The RF3 delivers with 150 WPH (wafer per hour) throughput. This benchmark performance is a function of its fast and reliable robotics, fast process time, ample parallel units, and wafer scheduling algorithms. Separate BARC and resist coat cells insure we are not throughput limited by wafer transfer robotics. State-of-the-art process technology results in fine CD control and the consistency needed for 90nm/65nm production. ArF resists are demonstrating greater PEB sensitivity compared to their KrF counterparts. Meeting the lithography demands of our customers mandates continual improvement of coat, develop, post exposure bake and thermal control. The RF3 modular hardware and electrical design provides the flexibility needed in today's lithography market. Modularity extends from the component level, to the process unit level, to the module level. This design concept has allowed us to significantly reduce manufacturing lead times and compress fab set-up to one week. Field modifications or enhancements to the track are also much easier.