The world's fastest, 200WPH throughput capable coat/develop track system performance is enabled by wafer transfer system optimization and the ability to mount additional process modules. The RF3S is a higher throughput, upgraded version of the highly regarded, highly reliable RF3 platform with additional features not available on the original RF3. The SOKUDO RF3 is the 300 mm/200 mm substrate, high-end production platform. In the field since 2003, the RF3 system is a proven workhorse for volume semiconductor manufacturing. Reliable, Fast, Fine, and Flexible are the key customer values of this platform. This 200 mm substrate system, SK-2000, features a compact footprint for traditional photolithography resist coat/develop processing. This 120WPH platform delivers solid performance and maintainability for volume semiconductor chip manufacturing. This coat/develop system is specifically designed for ease-of-use and low cost performance for a wide-range of semiconductor substrate processing. This mature technology platform ensures consistently high yields and robust manufacturing performance.