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21st Annual
SOKUDO Lithography Breakfast Forum 2014

Collaboration for Success

Wednesday, July 9, 2014
07:30 Breakfast, 08:00-10:00 Presentations

San Francisco Marriott Marquis,
Mission & 4th Street, San Francisco, California

Speakers: An Steegen, Senior VP, Process Technology, IMEC
Laurent Pain, Patterning Prog. Mgr., CEA-LETI
Mark Kelling, Director, Lithography, G450C
Steve Renwick, Sr. Research Scientist, NIKON RCA
Hans Meiling, Sr. Director, Prog. Mngt. EUV, ASML

The future of semiconductor IC patterning is at cross-roads between multiple lithography options, complementary and alternative technologies. Immersion ArF multi-patterning, EUV, Multi-E-beam, Directed Self-Assembly (DSA), etc. with 450mm wafer size transition on the horizon. The industry model for semiconductor manufacturing, equipment and materials development costs is by pre-competitive collaboration for success.

Presentation files available for registered attendees only. For inquiries please contact

Hosted by SOKUDO Co., Ltd., coat / develop track products Subsidiary of Dainippon Screen Mfg. Co., Ltd. in cooperation with SEMI

Annual SOKUDO Lithography Breakfast Forum History…
2013    2012    2011    2010    2009    2008    2007    2006    2005    2004    2003

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