SPIE Advanced Lithography 2010
Dates: February 21-25, 2010 (Sunday – Thursday)
Venue: San Jose Convention Center, San Jose, California (USA)
For more information see http://spie.org/advanced-lithography.xml
|
 |
Technical Conference
SOKUDO Co., Ltd. presented two (2) technical papers (posters) along with six (6) technical papers together with collaborations partners (Entegris, JSR, ASML, SELETE, IMEC) :
| 7636-111 |
Study of post-develop defect on typical EUV resist
SOKUDO |
| 7639-87 |
Study of post develop defect on TC-less immersion resist
SOKUDO |
| 7639-81 |
Simplified “Litho-Cluster-Only” solution for double patterning
JSR, ASML, SOKUDO |
| 7638-69 |
Immersion lithography micro-bridge defects: characterization and root cause analysis
IMEC, Entegris, SOKUDO |
| 7639-65 |
Further analysis of the effect of point-of-use filtration on microbridging defectivity
Entegris, IMEC, SOKUDO |
| 7636-115 |
Alternative resist processes for LWR reduction in EUVL
SELETE (co-authored by SOKUDO assignee, Koji Kaneyama) |
| 7639-26 |
Development of EUV-resists based on various new materials
SELETE (co-authored by SOKUDO assignee, Koji Kaneyama) |
| 7636-27 |
Development of resist material and process for hp 2x nm devices using EUV lithography
SELETE (co-authored by SOKUDO assignee, Koji Kaneyama) |
Exhibition Overview
SOKUDO Co., Ltd. showcased the new SOKUDO DUO platform as well as our RF3S and SK-80BW coater/developer track product line in exhibit booth 308.
|
